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EPI Products

EPI TECH | EPI Process | EPI Products | EPI Facilities

Item	Characteristics	Maximum Limit	Test Method
1	Dopant	P,P+:Boron N,N+:Phosphorus, Arsine
2	Orientation	<100>,<111>
3	Resistivity	P,N:10^-1 ~ 10²ohm.cm	ASTM F723
4	Resistivity Variation	<=±5%	For 6'
5	Resistivity Uniformity	<=±3%	For 6'
6	Layer Thickness	1 to 100 Micrometer	ASTM F95, F110
7	Thickness Variation	<=±5%	For 6'
8	Resistivity Uniformity	<=±3%	For 6'
9	Stacking Faults	10/cm²	ASTM F1810
10	Slip	5 lines, total length not toexceed semidiameter	ASTM F1725 F1726
11	Haze	NONE	ASTM F523
12	Scratches	NONE	ASTM F523
13	Craters, Orange Peel, Cracks, Crow's Feet	NONE	ASTM F523
14	Edge Chips	NONE	ASTM F523
15	Edge Crown	Projection above wafer surface not to exceed 1/3 of Epi layer thickness	To be defined
16	Foreign Matter	NONE	ASTM F523
17	Back Surface Contamination	NONE	ASTM F523
18	Point defects	SEMI Standard	ASTM F523

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Simgui gains the strength from its US-based parter, More Technologies,the acknowledged specialist in epitaxial technology. Simgui is benefiting from close collaboration with such leading substrate suppliers at home and abroad as Forrotec, Gritek and etc. Combing the effective, stable supply channels and its powerful, flexible processing ablility, Simgui has distinguished itself among its domestic and oversea competitors.